PCB Design Parameters

The following parameters are exemplary for 35μm copper thickness. For other thicknesses / critical designs, please check here to help.

Name

Min. dimensions

A, B, C

via, buried via

aspect ratio
final diameter
via pad
annular ring

1:12
75µm
225µm
75µm (enclosing)

D

blind via, mechanical


 
    max. Ø
    400µm

aspect ratio
final diameter
via pad
annular ring

1:1
100µm
400µm
150µm (enclosing)

E

blind via, laser

aspect ratio
final diameter
via pad
annular ring

1:1
75µm
225µm
75µm* (enclosing)

F

stacked via

Should be avoided, due to it`s disproportionately high use of time and effort. Please contact always our CAM department for alternatives.

aspect ratio
final diameter
via pad
annular ring

1:1 - 1:12 **
100µm
300µm
100µm

G

staggered via

aspect ratio
final diameter
via pad
annular ring

1:1 - 1:12 **
100µm
300µm
100µm

H, I

conductor traces (outer, inner) -
see Conductor / Copper Thickness

width
space

75µm
75µm

J

conductor / pad to milling edge
conductor / pad to scoring edge

space

200µm
500µm

K

conductor / pad to via

space

200µm

L

solder-stop coating

clearance
bridge width

50µm annular
100µm

* Annular ring depends on copper thickness! Please ask for critical designs.
** Aspekt ratio depends on Ø. 100µm 1:1, >100µm 1:4, >150µm 1:10, >200µm 1:12